Highlights 3nm Production, 2nm Design, 3DIC Capabilities and Multi-Die Advanced Packaging SAN JOSE, Calif., Sept. 14, 2026 — Alchip Technologies will showcase its leading-edge process technology and ...
SANTA CLARA, Calif.--(BUSINESS WIRE)--TSMC (TWSE: 2330, NYSE: TSM) today debuted its latest innovation in its most advanced process technology at the Company’s 2026 North America Technology Symposium.
BLUE RIDGE, Texas, Nov. 4, 2025 /PRNewswire/ -- Advanced Process Solutions (APS), an industry leader in precision manufacturing and process technology solutions, serving the semiconductor, electronics ...
Synopsys and TSMC Advance Analog Design Migration with Reference Flow Across Advanced TSMC Processes
AI-driven design solution enables circuit optimization, saving weeks of manual and iterative effort while increasing design quality. Interoperable process design kits for all advanced TSMC FinFET ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the availability of a certified node-to-node design migration flow based on the new generative AI-powered ...
Intel is trying to catch up with TSMC in terms of process technologies and advanced global production capacity, but when it comes to the U.S., the chip giant remains unrivalled. Intel's Fab 52 is more ...
Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...
Multi-generational agreement advances Intel’s IDM 2.0 strategy. Partnership broadens and accelerates IP access for Intel foundry ecosystem. Agreement builds on longstanding IP and EDA strategic ...
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