System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and ...
Fan-Out Wafer Level Packaging (FOWLP) has been established as one of the most versatile packaging technologies in the recent past and already accounts for a market value of over 1 billion USD due to ...
The impatient and hungry mobile electronics market is fueling the need for system packaging technologies as an interim solution before the inevitable transition to system-on-chip methodologies. While ...
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