From quartz sand to silicon wafers, the manufacturing process is critical for achieving the purity and quality needed for ...

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Semiconductor manufacturer Xanoptix (Merrimack, NH) has developed a wafer-scale process for the 3-D stacking of silicon with either GaAs or InP to make compound semiconductors. The company's Hybrid ...

Cerebras Systems and the federal Department of Energy's National Energy Technology Laboratory today announced that the company's CS-1 system is more than 10,000 times faster than a graphics processing ...

HONOLULU, June 12 /PRNewswire-FirstCall/ -- Before the start of the prestigious 2006 Symposium on VLSI Technology, Texas Instruments Incorporated (NYSE: TXN) (TI ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

TSMC is benefiting from the race to make more AI chips. The company is adding capacity and improving its processing technology. The stock is attractively priced given the opportunities ahead of it.

Partially defective, marginal die can still be functional enough to pass final electrical test. Some of these “walking wounded” chips get past final testing, but in the customer’s end product, under ...

A new chip manufacturing process from Intel Corp. failed to meet Broadcom Inc.’s expectations in a recent evaluation, Reuters reported today. The development may mark a setback for Intel’s foundry ...

Germany-based engineering company Lidrotec has developed a novel laser dicing process alongside Trumpf, which has helped to scale the process for mass production of wafers using its laser and beam ...

The company hasn't stopped on its journey of AI processor releases, with some truly crazy specifications for Cerebras' new WSE-3 chip. We have 4 trillion transistors, 900,000 AI-optimized cores, 125 ...

Semiconductor components increasingly require unclonable and tamper resistant identifiers, which are especially necessary as devices become increasingly heterogeneous collections of chiplets and ...