Manufacturer Cologne Chip solders its GateMate A1 onto a module that fits I/O boards for the Raspberry Pi CM5.

Rugged boards and modules were everywhere at this year’s Embedded World 2026. New form factors like VITA 93 QMC were on display along with those based on standards like COM Express. More boards and ...

At embedded world, on the DigiKey booth, Paige Hookway speaks with Tawfeeq Ahmad at iWave, about Advancing RF Innovation with FPGA System on Modules.

Infineon gives vertical power delivery a push with a new generation of multiphase power modules that can be tucked underneath ...

MicroCloud Hologram Inc. (NASDAQ: HOLO), ("HOLO" or the "Company"), a technology service provider, has developed a surface code quantum simulator based on FPGA. This innovative technology marks a new ...

Launches aimed at supporting transition towards multi-rack scale-up and high-bandwidth scale-out in AI data centers ...

SEALSQ Corp. (NASDAQ:LAES) is one of the best up and coming penny stocks to buy. On February 18, SEALSQ and Lattice Semiconductor announced a collaboration to integrate Trusted Platform ...

The "Micro Electrode Array Market - Growth, Share, Opportunities & Competitive Analysis, 2025 - 2032" report has been added to the Credence Research Inc. offering. The global Micro Electrode Array ...

Bill Cooper stated, "We expect a sequential decline in non-product revenue due to a project completion in Q4 2025, which will ...

The "Micro Electrode Array Market - Growth, Share, Opportunities & Competitive Analysis, 2025 - 2032" report has been added to the Credence Research Inc.

Mobile World Congress 2026 in Barcelona brought together semiconductor vendors, wireless infrastructure companies, and test-and-measurement suppliers to present new hardware platforms, chipsets, and ...

Pegatron 5G, a global leader in advanced networking and electronic manufacturing, today announced a joint collaboration with Metanoia a leader in 5G base station SoC and SDR to develop next generation ...