Intel can't spin up 18A fast enough, so Intel 7 is now the new CPU bottleneck

Intel's rebound in chip demand during the third quarter has been tempered by ongoing supply constraints that continue to limit the company's ability to deliver both ...
Semiconductor Engineering

Stop The Drip-Drip-Drip Of Intermittent In-Line Wafer Defects And Increase Your Yields

Full-blown process excursions that affect every wafer are comparatively easy for fabs to detect and fix. However, ...
Semiconductor Engineering

Charting The Frontiers Of Photomask Technology And Extreme Ultraviolet Lithography

The enormous computing demands of AI and high-performance computing (HPC) applications are putting intense pressure on every ...
The Tech Report

Nvidia’s Blackwell Wafer: The First Step Toward Onshored AI Chipmaking

Nvidia and TSMC have built the first Blackwell wafer in the US: a step toward reshoring the AI chip supply chain.
The American Bazaar

Nvidia unveils first Blackwell chip wafer made in the U.S. with TSMC

Nvidia unveiled its first U.S.-made Blackwell chip at TSMC’s Phoenix facility, marking a milestone in American semiconductor ...
Tom's Hardware on MSN

TSMC gives an ultra-rare video look inside its fabs — 'Silver Highway' and fab tools revealed in flyby video of company's US Arizona Fab 21

TSMC's new flyby video of its Fab 21 in Arizona offers a rare glimpse inside the fully operational N4/N5 cleanroom, ...
IEEE

In-House Test Wafer Reclaim for Fab Cost and Wastage Reduction

Abstract: In semiconductor fabrication facilities, non-production test wafers constitute a substantial amount of the non-equipment-related consumable expense. With the escalating demand and increased ...
EDN

X-FAB joins Thalia to bolster IP migration on its process nodes

Analog and mixed-signal specialty foundry X-FAB has joined hands with Thalia Design Automation to accelerate IP migration and preserve the design integrity of chips manufactured on its process nodes.