An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates” was published by ...

On-die Digital Impedance Sensing for Chiplet and Interposer Verification” was published by researchers at Worcester Polytechnic Institute. Abstract “The increasing complexity and cost of manufacturing ...

Researchers from the University of Tokyo propose cooling chips using microchannels built into the chips themselves. The ...

As designs grow more complex, detecting and eliminating underutilized components becomes increasingly challenging.